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PostPosted: Thu Jul 17, 2014 6:35 pm 
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Several years ago this was suggested/tried?/discredited on NBR. I seem to remember the dwagon waxing poetic on the subject.

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PostPosted: Thu Jul 17, 2014 7:00 pm 
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One of the problems with copper shims is that there is not any springs holding the heat sink down. It is screwed tight.
The copper shim would have to be precision thickness to within thousandths of an inch. Otherwise it either will not make good contact or it would be too tight and destroy the chip.

The thermal pads allows for a variance in the gap between the processor and the heatsink.

I like my chips crunchy.......(my Dwagon imitation)

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PostPosted: Thu Jul 17, 2014 10:48 pm 
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I posted above KNOWING you would fill in the blanks.

Thank you friend Shawn,

J'd

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PostPosted: Fri Jul 18, 2014 4:23 am 
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Always more than happy to give my 2 cents worth..

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PostPosted: Fri Jul 18, 2014 8:11 am 
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I appreciate your input, Shawn.

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PostPosted: Sat Jul 19, 2014 8:36 pm 
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(let's see how well the phone works while out in the Arkansas mountains on vacation) I have done copper shims before but not on a passively cooled system. They have all had a fan or too. The copper is great for helping pull the heat from the chip but you need to get the heat from the shim also. passively cooled doesn't work great for that.

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PostPosted: Tue Jul 22, 2014 4:04 pm 
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Phone seems to work fine there, ADOR ;. I guess we can all agree that it's just a bad idea on the CF-29.

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PostPosted: Tue Jul 22, 2014 6:05 pm 
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I just had a thought...You can't use the copper on the chips of a Toughbook, BUT we may be able place very thin strips of copper between the heat sink "arms" and the case.
I think that would improve the over all cooling.

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PostPosted: Tue Jul 22, 2014 7:36 pm 
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They do make stick on heat sinks they put on systems to improve the cooling, but then again that is for a fan based system. All that would do is add heat inside the case. You would need a larger passive tube cooling system. Maybe the ones one the CF-30 is larger? I would have to took at them side by side. I don't think they are close though.

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PostPosted: Thu Jul 24, 2014 8:49 pm 
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I think I read on some thread, possibly NBR, about some guy who added copper tubing in an attempt to improve heat dissipation from the aluminum heat sink. I think he frankensteined it from another laptop or something.

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